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Specific Process Knowledge/Characterization/Topographic measurement: Difference between revisions

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{| border="2" cellspacing="0" cellpadding="4" align="center"
{| border="2" cellspacing="0" cellpadding="4" align="center"
!
!
![[Specific Process Knowledge/Characterization/Profiler#Dektak_8_stylus_profiler|Dektak 8 stylus profiler]]
![[Specific Process Knowledge/Characterization/Profiler#Dektak_8_stylus_profiler|Dektak 8 stylus profiler]]
![[Specific Process Knowledge/Characterization/Profiler#Dektak_8_stylus_profiler|Dektak 8 stylus profiler]]
![[Specific Process Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
![[Specific Process Knowledge/Characterization/Profiler#Optical_Profiler_(Sensofar)|Optical Profiler (Sensofar)]]
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|- valign="top"
|'''General description'''
|'''General description'''
|Profiler for measuring micro structures. Can do wafer mapping and stress measurements.
|Profiler for measuring micro structures. Can do wafer mapping and stress measurements.
|Profiler for measuring micro structures. Can do wafer mapping and stress measurements.
|3D Profiler for measuring micro structures. Can do wafer mapping.
|3D Profiler for measuring micro structures. Can do wafer mapping.
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|'''Substrate size'''
|'''Substrate size'''
|up to 8"
|up to 8"
|up to 6"
|Up to more than 6"
|Up to more than 6"
|6" or less
|6" or less
|-valign="top"
|-valign="top"
|'''Max. scan range xy'''
|'''Max. scan range xy'''
|Line scan x: 50µm to 200mm  
|Line scan x: 50µm to 200mm
|Line scan x: 50µm to 200mm 
|Depending on the objective:
|Depending on the objective:
*One view: 127µmX95µm to 1270µmX955µm
*One view: 127µmX95µm to 1270µmX955µm
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|-valign="top"
|'''Max. scan range z'''
|'''Max. scan range z'''
|50Å to 262µm
|50Å to 1mm
|50Å to 1mm
|Depending on the objective and Z resolution:
|Depending on the objective and Z resolution:
*94.4µm ->9984µm
*94.4µm ->9984µm
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|'''Resolution xy'''
|'''Resolution xy'''
|down to 0.067 µm
|down to 0.067 µm
|down to xxx µm
|Depending on the objective:
|Depending on the objective:
*0.5µm -> 5µm
*0.5µm -> 5µm
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|-valign="top"
|'''Resolution z'''
|'''Resolution z'''
|1Å, 10Å or 20Å
|1Å, 10Å or 20Å
|1Å, 10Å or 20Å
|Depending on measuring methode:
|Depending on measuring methode:
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|- valign="top"
|'''Max. scan depth [µm] (as a function of trench width W''')
|'''Max. scan depth [µm] (as a function of trench width W''')
|1.2*(W[µm]-5µm)
|1.2*(W[µm]-5µm)
|1.2*(W[µm]-5µm)
|Depending on material and trench width:
|Depending on material and trench width:
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|-valign="top"
|-valign="top"
|'''Tip radius'''
|'''Tip radius'''
|5 µm 45<sup>o</sup> cone
|5 µm 45<sup>o</sup> cone
|5 µm 45<sup>o</sup> cone
|No tip - using light
|No tip - using light
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|-valign="top"
|-valign="top"
|'''Stress measurement'''
|'''Stress measurement'''
|Can be done
|Can be done
|Can be done
|No stress calculation capability
|No stress calculation capability
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|-valign="top"
|'''Surface roughness'''
|'''Surface roughness'''
|Can be done on a line scan
|Can be done on a line scan
|Can be done on a line scan
|Can be done on a line or an area
|Can be done on a line or an area