Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300: Difference between revisions
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**Au etch with Ti as masking material | **Au etch with Ti as masking material | ||
*Etch in Stainless steel with X as masking material | *Etch in Stainless steel with X as masking material | ||
*Process develop | |||
**[[/Etch slow|Etch slow: resist can be removed with actone after etch]] | |||
===Deposition=== | ===Deposition=== | ||