Specific Process Knowledge/Etch/Etching of Silicon Oxide: Difference between revisions
| Line 38: | Line 38: | ||
*(Poly)Silicon | *(Poly)Silicon | ||
*Aluminium | *Aluminium | ||
*Chromium | *Chromium (ONLY is the other masking materials can not be used!) | ||
|- valign="top" | |- valign="top" | ||
|'''Etch rate''' | |'''Etch rate''' | ||
| Line 92: | Line 92: | ||
*E-beam resist | *E-beam resist | ||
*Aluminium | *Aluminium | ||
*Chromium | *Chromium (ONLY as masking material if the other masking materials can not be used!) | ||
|- | |- | ||
|} | |} | ||