Specific Process Knowledge/Characterization/Element analysis: Difference between revisions
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* A clean sample that has definitely not been contaminated: A pristine wafer | * A clean sample that has definitely not been contaminated: A pristine wafer | ||
All three samples are then exposed to the caesium beam and the count rate at the mass 196 atomic units (gold) is compared. | All three samples are then exposed to the caesium beam and the count rate at the mass 196 atomic units (gold) is compared. | ||
== Typical application of XPS == | == Typical application of XPS == | ||
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The XPS can be used for different applications, for example: | The XPS can be used for different applications, for example: | ||
* Do an elemental analysis of the outermost layer of your surface. | |||
* Check the composition of a film at different depths. | |||
* Checking for a contamination. | * Checking for a contamination. | ||
** It not as sensitive as the SIMS, but faster, so it can be an alternative if you are checking for higher contamination levels (like 1 %) | |||
* Do a analysis of the chemical state of atoms present on the surface. | |||
** See what effect has a surface treatment of your sample has. | |||
** Check a polymer covered surface. Are for example (C=O), (C-OH) (C-C) groups present in the polymer after it been deposited on a surface. | |||