Specific Process Knowledge/Characterization/Element analysis: Difference between revisions
No edit summary |
No edit summary |
||
| Line 85: | Line 85: | ||
* A clean sample that has definitely not been contaminated: A pristine wafer | * A clean sample that has definitely not been contaminated: A pristine wafer | ||
All three samples are then exposed to the caesium beam and the count rate at the mass 196 atomic units (gold) is compared. | All three samples are then exposed to the caesium beam and the count rate at the mass 196 atomic units (gold) is compared. | ||
== Typical application of XPS == | |||
The XPS can be used for different applications, for example: | |||
* Checking for a contamination. | |||
- It not as sensitive as the SIMS, but faster, so it can be an alternative if you checking for higher contamination levels (like 1 %) | |||
== Spatial resolution using EDX == | == Spatial resolution using EDX == | ||