Specific Process Knowledge/Characterization/XPS: Difference between revisions
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[[Image:Stochiometry 20110510.JPG|425x425px|left|thumb|The composition of a NiCr as a function of film depth (etch time). The relationship between Cr and Ni is quite constant through the 70nm thick film. Measurements done with XPS-ThermoScientific. ]] | [[Image:Stochiometry 20110510.JPG|425x425px|left|thumb|The composition of a NiCr as a function of film depth (etch time). The relationship between Cr and Ni is quite constant through the 70nm thick film. Measurements done with XPS-ThermoScientific. ]] | ||
The analysis is made on a chosen spot on the sample surface ( | The analysis is made on a chosen spot on the sample surface (choosen with the system camera). The technique, is as written above, very surface sensitive and probes only the top nanometers of the sample. | ||
With the ion beam gun on the system a etch of the sample can be done. The system measures the desired spectra, do a etch step and measures the again. A series of etch cycles can be set up, measuring the composition of the sample through at different depths. | With the ion beam gun on the system a etch of the sample can be done. The system measures the desired spectra, do a etch step and measures the again. A series of etch cycles can be set up, measuring the composition of the sample through at different depths. | ||