Specific Process Knowledge/Characterization/XPS: Difference between revisions
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XPS is a surface sensitive and non destructive technique used for analysis of the elemental composition. | XPS is a surface sensitive and non destructive technique used for analysis of the elemental composition. | ||
Only the outermost atomic layers (some nanometers) are probed, but with an ion etch | Only the outermost atomic layers (some nanometers) are probed, but with an ion gun etch it is possibile to probe deeper laying layers. | ||
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As an illustration, a figure to the left, shows an elemental analysis through a metallic film consisting of Ni and Cr. The metallic layer was about 70 nm thick, and the atomic percentage of Ni and Cr was measured through the layer. | As an illustration, a figure to the left, shows an elemental analysis through a metallic film consisting of Ni and Cr. The metallic layer was about 70 nm thick, and the atomic percentage of Ni and Cr was measured through the layer. | ||
In the graph, you see the atomic % as a function of etch depth, and it is possible to detect that the relationship between Ni and Cr is fairly constant through the metallic film. | In the graph, you see the atomic % as a function of etch depth, and it is possible to detect that the relationship between Ni and Cr is fairly constant through the metallic film. | ||
==A rough overview of XPS-ThermoScientific characteristics== | ==A rough overview of XPS-ThermoScientific characteristics== | ||