Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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! [[Specific Process Knowledge/Etch/DRIE-Pegasus/processB|Process B]] | |||
| Bosch | |||
| Fast etch | |||
| 30 µm diameter via | |||
| Photo resist | |||
| 12-13 % on 6" wafer | |||
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|} | |} | ||