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Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

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Bureaucrats, danchip, Administrators
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Bureaucrats, danchip, Administrators
1,918 edits
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! Best usage
! Best usage
|-
|-
| Bosch
| width="120" | Fast etch 
! width="120" | Feature
! width="120" | Feature
! width="120" | Mask material
! width="120" | Mask material
! width="120" | Etch load
! width="120" | Etch load
! width="120" | sice
! width="120" | sice
| Cleavage lines
|-
! Process A
| Bosch
| Fast etch
| 80 µm trench
| Photo resist
| 12-13 % on 6" wafer
| asf
| Fast ettw
|-
|-
|}
|}
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