Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

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 {| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
-|+ '''Standard processes'''
+|+ '''Most commonly used processes on DRIE-Pegasus'''
 |-
-!
+! Process name
-! colspan="2" | Step 1
+! Type
-! colspan="2" | Step 2
+! Purpose
+! colspan="4" | Conditions during original runs
+! Best usage
 |-
-! width="120" | Parameter
+! Process A
-! width="120" | Etch
+| Bosch
-! width="120" | Dep
+! width="120" | Fast etch
-! width="120" | Etch
+! width="120" | Feature
-! width="120" | Dep
+! width="120" | Mask material
+! width="120" | Etch load
+! width="120" | sice
+| Cleavage lines
 |-
-! Gas flow (sccm)
-| SF<sub>6</sub> 350 (1.5 s) 550
-| C<sub>4</sub>F<sub>8</sub> 200
-| SF<sub>6</sub> 350 (1.5 s) 550
-| C<sub>4</sub>F<sub>8</sub> 200
-|-
-! Cycle time (secs)
-| 7.0
-| 4.0
-| 7.0
-| 4.0
-|-
-! Pressure (mtorr)
-| 25 (1.5 s) 90 >> 150
-| 25
-| 25 (1.5 s) 150
-| 25
-|-
-! Coil power (W)
-| 2800
-| 2000
-| 2800
-| 2000
-|-
-! Platen power (W)
-| 120 >> 140 (1.5) 45
-| 0
-| 140 (1.5) 45
-| 0
-|-
-! Cycles
-| colspan="2" | 11 (keep fixed)
-| colspan="2" | 44 (vary this)
-|-
-! Common
-| colspan="4" | Temperature 20 degs, HBC 10 torr, Short funnel, with baffle & 5mm spacers
 |}