Specific Process Knowledge/Thin film deposition/Wordentec: Difference between revisions
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*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver (Ag)]] | *[[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver (Ag)]] | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium|Titanium (Ti)]] | *[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium|Titanium (Ti)]] | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon|Silicon (Si)]] | |||
More information about deposition rates and surface roughness can be found by clicking on the different elements. | More information about deposition rates and surface roughness can be found by clicking on the different elements. | ||
== Overview of the performance of Wordentec and some process related parameters== | == Overview of the performance of Wordentec and some process related parameters== | ||
Revision as of 13:06, 15 August 2012
Wordentec QCL 800
The Wordentec is a machine for:
- Deposition of metal through E-beam deposition
- Deposition of metal through thermal evaporation
- Deposition of materials through DC sputtering
- Cleaning of samples before deposition through Argon RF sputter clean
The Wordentec is designed to deposit on 1-6 samples in sequence, samples of a size up to 6" in diameter. Adaptors exist for deposition on 2", 4" and 6" wafers, but deposition is possible on samples of almost any size and shape, as long as they do not exceed the size of a 6" substrate. The Wordentec supports either single sample deposition on each sample or batch deposition on six wafers in sequence. It is possible to freely combine processes from the machines different sources.
Process information
The metals available for E-beam evaporation and their standard deposition rates are:
| Metal | Deposition rate [Å/s] |
|---|---|
| Titanium (Ti) | 10 |
| Chromium (Cr) | 10 |
| Aluminium (Al) | 10 |
| Nickel (Ni) | 10 |
| Platinum (Pt) | 10 |
| Gold (Au) | 10 |
Thermal evaporation materials
We currently only have Aluminium and Silver available to deposit through thermal evaporation.
Sputter materials
It is possible to sputter deposit almost any material, provided that it is possible to deposit with DC sputtering. The materials available currently are:
- TiW alloy (10%/90% by weight)
- Aluminium (Al)
- Chromium (Cr)
- Silver (Ag)
- Titanium (Ti)
- Silicon (Si)
More information about deposition rates and surface roughness can be found by clicking on the different elements.
| Purpose | Deposition of metals |
|
|---|---|---|
| Performance | Film thickness |
|
| Deposition rate |
| |
| Process parameter range | Process Temperature |
|
| Process pressure |
| |
| Substrates | Batch size |
|
| Substrate material allowed |
| |
| Material allowed on the substrate |
|