Specific Process Knowledge/Polymer Processing/Plasma Cleaners

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Plasma cleaner: 2 & 3

Plasma Cleaner:2 is located in PolyFabLab, and Plasma Cleaner: 3 is located in the PDMS lab in building 347.

Plasma cleaner 2 : SurfacePrep(located in PolyFaLab) and Plasma cleaner 3 : PDMS (located in PDMS lab) are Diener Atto (PC control, 13.56 MHz RF) systems installed in 2026.

The Plasma Cleaner 2 : SurfacePrep can be used for the following processes:

• Fine cleaning/surface activation of polymer parts prior to bonding, coating, printing
• Photoresist stripping
• Descumming
• Surface cleaning

The user manual, and contact information for plasma cleaner : 2 can be found in LabManager - requires login

The Plasma Cleaner 3 : PDMS can be used for the following processes:

• Surface activation and micro-etching of cured PDMS surface
• PDMS to glass bonding

For further information about PDMS to glass bonding follow the link: [[1]]

The user manual, and contact information for plasma cleaner : 3 can be found in LabManager - requires login

Plasma cleaner Comparison Table

	Plasma Cleaner 2 : Surfaceprep	Plasma Cleaner 3: PDMS
Purpose	Cleaning/Surface activation before bonding, coating and printing	Surface activation and micro-etching of cured PDMS
Method	Low-pressure RF plasma	Low-pressure RF plasma
Process gasses	O2 N2 Ar (Upon request)	O2 Ar (Upon request)
Process power	10-300 W (10-100%)	10-300 W (10-100%)
Process pressure	0.35 mbar	0.35 mbar
Substrate batch	Chips: several 50 mm wafer: 1 100 mm wafer: 1	Chips: several 50 mm wafer: 1 100 mm wafer: 1
Substrate materials	Polymer substrates Silicon substrates III-V substrates Glass substrates Films, or patterned films, of any material except type IV (Pb, Te)	PDMS Polymer substrates Silicon substrates III-V substrates Glass substrates Films, or patterned films, of any material except type IV (Pb, Te)