Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions
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Alternative methods for high-thruput fabrication like using wafer-size punching dies, laser ablation, machining/milling and air/water jet machining are under investigation to meet the demands of the industry and large interdisciplinary projects. | Alternative methods for high-thruput fabrication like using wafer-size punching dies, laser ablation, machining/milling and air/water jet machining are under investigation to meet the demands of the industry and large interdisciplinary projects. | ||
'''Punching''' | '''Punching''' | ||
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[[File:PDMS through-hole methods.jpg|580px|thumb|left|Scanning Electron Microscopy (SEM) micrographs for comparison of methods to fabricate through-holes in PDMS ]][[File:Manual puncher.jpg|thumb|Example of a 20 mm commercial puncher used to cut individual chips out of a PDMS microfluidic wafer]] | [[File:PDMS through-hole methods.jpg|580px|thumb|left|Scanning Electron Microscopy (SEM) micrographs for comparison of methods to fabricate through-holes in PDMS ]][[File:Manual puncher.jpg|thumb|Example of a 20 mm commercial puncher used to cut individual chips out of a PDMS microfluidic wafer]] | ||