Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions

Revision as of 16:34, 16 July 2026 view source Cchvi (talk \| contribs) NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231 125 edits →Cutting PDMS ← Older edit		Revision as of 16:35, 16 July 2026 view source Cchvi (talk \| contribs) NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231 125 edits →Cutting PDMS Newer edit →
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	Clean well the place before leaving. Dispose all cellophane liner used. Be sure no residues of PDMS are left in the work areas, and place all PDMS residues in the C-waste container.		Clean well the place before leaving. Dispose all cellophane liner used. Be sure no residues of PDMS are left in the work areas, and place all PDMS residues in the C-waste container.

	[[File:PDMS through-hole methods.jpg\|~~600px~~\|thumb\|left\|Scanning Electron Microscopy (SEM) micrographs for comparison of methods to fabricate through-holes in PDMS ]][[File:Manual puncher.jpg\|thumb\|Example of a 20 mm commercial puncher used to cut individual chips out of a PDMS microfluidic wafer]]		[[File:PDMS through-hole methods.jpg\|550px\|thumb\|left\|Scanning Electron Microscopy (SEM) micrographs for comparison of methods to fabricate through-holes in PDMS ]][[File:Manual puncher.jpg\|thumb\|Example of a 20 mm commercial puncher used to cut individual chips out of a PDMS microfluidic wafer]]