Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions
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Cutting of PDMS to create access ports, also known as througholes, or for separating the individual chips from a microfluidic PDMS wafer are common steps in the fabrication of PDMS microfluidics. The PDMS lab thrives on providing the optimal tools and processes for researchers and users. Common tools that are provided in the lab for manual cutting are tweezers, blades, cutting mats, light screen and press. | Cutting of PDMS to create access ports, also known as througholes, or for separating the individual chips from a microfluidic PDMS wafer are common steps in the fabrication of PDMS microfluidics. The PDMS lab thrives on providing the optimal tools and processes for researchers and users. Common tools that are provided in the lab for manual cutting are tweezers, blades, cutting mats, light screen and press. | ||
Alternative methods for high-thruput fabrication like using wafer-size punching dies, laser ablation, machining/milling and air/water jet machining are under investigation to meet the demands of the industry and large interdisciplinary projects. | Alternative methods for high-thruput fabrication like using wafer-size punching dies, laser ablation, machining/milling and air/water jet machining are under investigation to meet the demands of the industry and large interdisciplinary projects. | ||
[[File:Manual puncher.jpg|thumb|Example of a 20 mm commercial puncher used to cut individual chips out of a PDMS microfluidic wafer]] | |||
'''Punching''' | '''Punching''' | ||