Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions
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==3D printing== | ==3D printing== | ||
[[File:Manual puncher.jpg|thumb|Example of a 20 mm commercial puncher used to cut individual chips out of a PDMS microfluidic wafer]] | |||
==Cutting PDMS== | ==Cutting PDMS== | ||
'''Punching''' | '''Punching''' | ||
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Clean well the place before leaving. Dispose all cellophane liner used. Be sure no residues of PDMS are left in the work areas, and place all PDMS residues in the C-waste container. | Clean well the place before leaving. Dispose all cellophane liner used. Be sure no residues of PDMS are left in the work areas, and place all PDMS residues in the C-waste container. | ||
[[File:PDMS through-hole methods.jpg| | [[File:PDMS through-hole methods.jpg|1300px|thumb|center|Scanning Electron Microscopy (SEM) micrographs for comparison of methods to fabricate through-holes in PDMS ]] | ||
'''Laser ablation''' | '''Laser ablation''' | ||