Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions
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'''Baking – Curing''' | '''Baking – Curing''' | ||
[[File:PDMS film casted.jpg|thumb|Photograph of a PDMS microfluidic wafer after curing and demolding]] | |||
The PDMS can cure without heating in ~24 hours. Curing the PDMS at higher temperatures in the oven can decrease the time spent curing. The temperatures between 60°C to 100°C can be used, and the choice must be optimized for the specific device design, and the desired mechanical and surface properties. The curing time depends on the temperature and the thickness of PDMS. As a standard procedure to cure PDMS, place the casted PDMS on the mold in the oven for at least 2 hours at ~80°C. | The PDMS can cure without heating in ~24 hours. Curing the PDMS at higher temperatures in the oven can decrease the time spent curing. The temperatures between 60°C to 100°C can be used, and the choice must be optimized for the specific device design, and the desired mechanical and surface properties. The curing time depends on the temperature and the thickness of PDMS. As a standard procedure to cure PDMS, place the casted PDMS on the mold in the oven for at least 2 hours at ~80°C. | ||
'''Demolding''' | '''Demolding''' | ||