Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions
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'''This page is under construction''' | '''This page is under construction''' | ||
For further information contact Stephan Sylvest Keller suke@dtu.dk or Claudia Chaves Villarreal cchvi@dtu.dk | |||
'''Contents''' | |||
1. Material requirements | |||
2. Process flow | |||
3. Mixing PDMS resin and degassing | |||
4. Soft lithography micro molding | |||
4.1 Mold surface conditioning | |||
4.2 Molding by pouring | |||
4.3 Molding by spin coating. | |||
4.4 Baking – Curing | |||
4.5 Alignment – Demolding | |||
5. 3D printing | |||
6. Cutting PDMS | |||
6.1 Punching | |||
6.2 Laser ablation | |||
6.3 Machining/milling | |||
6.4 Air/water jet machining | |||
7. Bonding | |||
7.1 PDMS/PDMS and PDMS/glass bonding | |||
7.2 PDMS/PMMA bonding | |||
8. References | |||