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Specific Process Knowledge/Back-end processing/PDMS Microfluidic: Difference between revisions

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this page is for PDMS microfluidic
'''This page is under construction'''
 
I. Material requirements
 
II. Typical process flow
 
III. Surface conditioning
 
IV. Mixing – degassing
 
V. Molding
 
VI. Spin coating
 
VII. Baking – Curing
 
VIII. Alignment – Demolding
 
IX.       Punching access ports/througholes
 
X.      3D printing
 
XI.       Laser ablation
 
XII.     Machining/milling
 
XIII.    Air/water jet machining
 
XIV.    Bonding
 
PDMS/PDMS and PDMS/glass bonding
 
PDMS/PMMA bonding
 
References.
 
 
For further information contact Stephan Sylvest Keller suke@dtu.dk or Claudia Chaves Villarreal cchvi@dtu.dk

Revision as of 13:52, 16 July 2026

This page is under construction

I. Material requirements

II. Typical process flow

III. Surface conditioning

IV. Mixing – degassing

V. Molding

VI. Spin coating

VII. Baking – Curing

VIII. Alignment – Demolding

IX.       Punching access ports/througholes

X.      3D printing

XI.       Laser ablation

XII.     Machining/milling

XIII.    Air/water jet machining

XIV.    Bonding

PDMS/PDMS and PDMS/glass bonding

PDMS/PMMA bonding

References.


For further information contact Stephan Sylvest Keller suke@dtu.dk or Claudia Chaves Villarreal cchvi@dtu.dk