Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
| Line 6: | Line 6: | ||
<div style="float:center; border:thick solid blue;"> | <div style="float:center; border:thick solid blue;"> | ||
# All wafers must be processed using the MACS cassette loader and the automatic mode. The only exceptions are bonded wafers and 150 mm wafers - see point | # All wafers must be processed using the MACS cassette loader and the automatic mode. The only exceptions are bonded wafers and 150 mm wafers - see point 3. Batch recipes must be prepaired - even for single wafer trial runs. | ||
# The backsides of the wafers must be absolutely clean | # The backsides of the wafers must be absolutely clean: Wipe with IPA or blow dry the backside of every wafer. | ||
# Loading bonded wafers using the load must be done with utmost care avoiding to change the position of the carousel. | # Loading bonded wafers using the load must be done with utmost care avoiding to change the position of the carousel. | ||
</div> | </div> | ||