Specific Process Knowledge/Lithography/Coaters: Difference between revisions
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=Coater Comparison Table= | =Coater Comparison Table= | ||
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{| | |- | ||
! | |||
! | ! [[Specific_Process_Knowledge/Lithography/Coaters/GammaUV|Spin Coater: Gamma UV]] | ||
! [[Specific_Process_Knowledge/Lithography/Coaters/GammaDUV|Spin Coater: Süss Stepper]] | |||
! [[Specific_Process_Knowledge/Lithography/Coaters/GammaEbeam|Spin Coater: Gamma E-beam and UV]] | |||
! [[Specific_Process_Knowledge/Lithography/Coaters/RCD8|Spin Coater: RCD8]] | |||
! [[Specific_Process_Knowledge/Lithography/Coaters/labspin|Spin Coater: LabSpin 02]] | |||
! [[Specific_Process_Knowledge/Lithography/Coaters/labspin|Spin Coater: LabSpin 03]] | |||
! [[Specific_Process_Knowledge/Lithography/Coaters/labspin04|Spin Coater: LabSpin 04]] | |||
! [[Specific_Process_Knowledge/Lithography/Coaters/sprayCoater|Spray Coater]] | |||
|- | |- | ||
! scope=row| Purpose | |||
! | | | ||
*In-line substrate HMDS priming | *In-line substrate HMDS priming | ||
*Coating and baking of | *Coating and baking of | ||
| Line 31: | Line 28: | ||
**AZ nLOF 2020 | **AZ nLOF 2020 | ||
**AZ 5214E | **AZ 5214E | ||
| | |||
*Coating and baking of | *Coating and baking of | ||
**BARC (DUV42S-6) | **BARC (DUV42S-6) | ||
| Line 37: | Line 34: | ||
**KRF M35G | **KRF M35G | ||
**UVN2300-0.8 | **UVN2300-0.8 | ||
| | |||
*In-line substrate HMDS priming | *In-line substrate HMDS priming | ||
*Coating and baking of | *Coating and baking of | ||
| Line 45: | Line 42: | ||
**AZ 4562 | **AZ 4562 | ||
*Edge bead removal on novolac-based resist and SU-8 | *Edge bead removal on novolac-based resist and SU-8 | ||
| | |||
*Coating of | *Coating of | ||
**SU-8 | **SU-8 | ||
| Line 53: | Line 50: | ||
**AZ nLOF | **AZ nLOF | ||
*Edge bead removal | *Edge bead removal | ||
|colspan="2 | |colspan="2"| | ||
*Coating of E-beam resists | *Coating of E-beam resists | ||
** CSAR, ZEP, PMMA/MMA, HSQ(FOx) | ** CSAR, ZEP, PMMA/MMA, HSQ(FOx) | ||
| Line 59: | Line 56: | ||
**AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8 | **AZ5214E, AZ4562, AZMiR701, AZnLOF, SU-8 | ||
*Coating of imprint resists | *Coating of imprint resists | ||
| | |||
*Coating of | *Coating of | ||
**SU-8 | **SU-8 | ||
| Line 65: | Line 62: | ||
**other resists | **other resists | ||
OBS: this tool is in PolyFabLab | OBS: this tool is in PolyFabLab | ||
| | |||
*Spraying imprint resist | *Spraying imprint resist | ||
*Spraying photoresist | *Spraying photoresist | ||
*Spraying of other solutions | *Spraying of other solutions | ||
|- | |- | ||
! scope=row| Substrate handling | |||
! | | | ||
* Cassette-to-cassette | * Cassette-to-cassette | ||
* Vacuum handling and detection | * Vacuum handling and detection | ||
* Vacuum spin chuck | * Vacuum spin chuck | ||
| | |||
* Cassette-to-cassette | * Cassette-to-cassette | ||
* Vacuum handling and detection | * Vacuum handling and detection | ||
* Vacuum spin chuck | * Vacuum spin chuck | ||
| | |||
* Cassette-to-cassette | * Cassette-to-cassette | ||
* Vacuum handling and detection | * Vacuum handling and detection | ||
* Vacuum spin chuck | * Vacuum spin chuck | ||
| | |||
* Single substrate | * Single substrate | ||
* Vacuum chuck for 4" and 6" | * Vacuum chuck for 4" and 6" | ||
* 4" non-vacuum chuck for fragile substrates | * 4" non-vacuum chuck for fragile substrates | ||
|colspan="2 | |colspan="2"| | ||
* Single substrate | * Single substrate | ||
* Vacuum chucks for chips, 2", 4", and 6" | * Vacuum chucks for chips, 2", 4", and 6" | ||
* 4" edge handling chuck | * 4" edge handling chuck | ||
| | |||
* Single substrate | * Single substrate | ||
* Vacuum chucks for chips, 4", and 6" | * Vacuum chucks for chips, 4", and 6" | ||
| Line 99: | Line 94: | ||
Can handle almost any sample size and shape | Can handle almost any sample size and shape | ||
|- | |- | ||
! scope=row| Permanent medias | |||
| | |||
* AZ MiR 701 (29cps) resist | * AZ MiR 701 (29cps) resist | ||
* AZ nLOF 2020 resist | * AZ nLOF 2020 resist | ||
* AZ 5214E resist | * AZ 5214E resist | ||
* PGMEA solvent for backside rinse and spinner bowl cleaning | * PGMEA solvent for backside rinse and spinner bowl cleaning | ||
| | |||
* DUV42S-6 (BARC) | * DUV42S-6 (BARC) | ||
* KRF M230Y resist | * KRF M230Y resist | ||
* KRF M35G resist | * KRF M35G resist | ||
* PGMEA solvent for edge bead removal and backside rinse | * PGMEA solvent for edge bead removal and backside rinse | ||
| | |||
* AR-P 6200.09 (CSAR) for 2", 4", and 6" | * AR-P 6200.09 (CSAR) for 2", 4", and 6" | ||
* AZ5214E for 2", 4", and 6" | * AZ5214E for 2", 4", and 6" | ||
| Line 117: | Line 111: | ||
* AZ4562 for 4", and 6" | * AZ4562 for 4", and 6" | ||
* PGMEA solvent for edge bead removal, backside rinse, and spinner bowl cleaning | * PGMEA solvent for edge bead removal, backside rinse, and spinner bowl cleaning | ||
| | |||
No permanent media | No permanent media | ||
|colspan="2"| Only manual dispense | |||
| Only manual dispense | |||
| No permanent media | |||
|- | |- | ||
! scope=row| Manual dispense option | |||
| | |||
* no manual dispense | * no manual dispense | ||
* syringe dispense (60cc) of PGMEA-based resist | * syringe dispense (60cc) of PGMEA-based resist | ||
| | |||
* no manual dispense | * no manual dispense | ||
* syringe dispense (60cc) of PGMEA and anisole-based resist | * syringe dispense (60cc) of PGMEA and anisole-based resist | ||
| | |||
* no manual dispense | * no manual dispense | ||
* syringe dispense (30cc) of PGMEA and anisole-based resist (2" only) | * syringe dispense (30cc) of PGMEA and anisole-based resist (2" only) | ||
| | |||
* yes | * yes | ||
* pneumatic dispense for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span> | * pneumatic dispense for SU-8 resist and EBR solvent <span style="color:red">OBS: disabled 2024</span> | ||
|colspan="2 | |colspan="2"| Only manual dispense | ||
| Only manual dispense | |||
| | | Two syringe pumps | ||
Two syringe pumps | |||
|- | |- | ||
! scope=row| Spindle speed | |||
! | | 10 - 6000 rpm | ||
| 10 - 6000 rpm | |||
| | | 10 - 6000 rpm | ||
10 - 6000 rpm | | 10 - 5000 rpm (3000 rpm with non-vacuum chuck) | ||
| | |colspan="2"| 100 - 8000 rpm (3000 rpm with edge handling chuck) | ||
10 - 6000 rpm | | 100 - 8000 rpm | ||
| | | NA | ||
10 - 6000 rpm | |||
| | |||
10 - 5000 rpm (3000 rpm with non-vacuum chuck) | |||
|colspan="2 | |||
100 - 8000 rpm (3000 rpm with edge handling chuck) | |||
| | |||
100 - 8000 rpm | |||
| | |||
|- | |- | ||
! scope=row| Gyrset | |||
| No | |||
| | | No | ||
| No | |||
| | | Optional (max. speed 3000 rpm) | ||
|colspan="2"| No | |||
| | | No | ||
| NA | |||
| | |||
|colspan="2 | |||
| | |||
|- | |- | ||
! scope=row| Substrate size | |||
! | | | ||
*50 mm wafers (tool change required) | *50 mm wafers (tool change required) | ||
*100 mm wafers | *100 mm wafers | ||
*150 mm wafers | *150 mm wafers | ||
*200 mm wafers (tool change required) | *200 mm wafers (tool change required) | ||
| | |||
*100 mm wafers | *100 mm wafers | ||
*150 mm wafers | *150 mm wafers | ||
*200 mm wafers (may require tool change) | *200 mm wafers (may require tool change) | ||
| | |||
*2" or 50 mm wafers | *2" or 50 mm wafers | ||
*100 mm wafers | *100 mm wafers | ||
*150 mm wafers | *150 mm wafers | ||
| | |||
*100 mm wafer | *100 mm wafer | ||
*150 mm wafer | *150 mm wafer | ||
|colspan="2 | |colspan="2"| | ||
*50 mm wafers | *50 mm wafers | ||
*100 mm wafers | *100 mm wafers | ||
*150 mm wafer | *150 mm wafer | ||
*small pieces down to 5x5 mm2 | *small pieces down to 5x5 mm2 | ||
| | |||
*100 mm wafers | *100 mm wafers | ||
*150 mm wafer | *150 mm wafer | ||
*small pieces down to 5x5 mm2 | *small pieces down to 5x5 mm2 | ||
| | |||
Any sample(s) that fit inside machine | Any sample(s) that fit inside machine | ||
|- | |- | ||
! scope=row| Batch size | |||
| 1 - 25 | |||
| | | 1 - 25 | ||
1 - 25 | | 1 - 25 | ||
| | | 1 | ||
1 - 25 | |colspan="2"| 1 | ||
| | | 1 | ||
1 - 25 | | 1 | ||
| | |||
1 | |||
|colspan="2 | |||
1 | |||
| | |||
1 | |||
| | |||
1 | |||
|- | |- | ||
! scope=row| Allowed substrate materials | |||
| | |||
*Silicon | *Silicon | ||
*Glass | *Glass | ||
'''No resist or crystalbond allowed in the HMDS module''' | '''No resist or crystalbond allowed in the HMDS module''' | ||
| | |||
*Silicon | *Silicon | ||
*Glass | *Glass | ||
| | |||
*Silicon | *Silicon | ||
*III-V materials | *III-V materials | ||
| Line 240: | Line 205: | ||
'''No resist or crystalbond allowed in the HMDS module''' | '''No resist or crystalbond allowed in the HMDS module''' | ||
| | |||
All cleanroom materials except III-V materials | All cleanroom materials except III-V materials | ||
|colspan="2 | |colspan="2"| | ||
*Silicon | *Silicon | ||
*III-V materials | *III-V materials | ||
*Glass | *Glass | ||
| | |||
All PolyFabLab materials | All PolyFabLab materials | ||
| | |||
*All chemicals to be spray coated must be approved specifically for spray coating | *All chemicals to be spray coated must be approved specifically for spray coating | ||
*Any non-toxic, non-particulate and non-crosslinking material is likely to be approved | *Any non-toxic, non-particulate and non-crosslinking material is likely to be approved | ||
|- | |- | ||
|} | |} | ||
=Spin coating= | =Spin coating= | ||