Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions

Revision as of 10:37, 14 September 2011

Silver can be deposited by e-beam or thermal evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	Thermal evaporation (Wordentec)	E-beam evaporation (PVD co-sputter/evaporation)
Batch size	Up to 1x4" wafers smaller pieces	6x6" wafers or 6x4" wafers or 24x2" wafers	4x6" wafers or 4x4" wafers or 2x2" wafers
Pre-clean	RF Ar clean	RF Ar clean	RF Ar clean
Layer thickness	10Å to 1µm	10Å to 0.5µm (0.5µm not on all wafers)	10Å to 1000Å
Deposition rate	2Å/s to 15Å/s	1Å/s to 10 Å/s	About 1Å/s

Thermal deposition of Silver - Process settings for thermal deposition of Silver in Wordentec

@@ Line 6: / Line 6: @@
 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
 ! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
+! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
 |-
 | Batch size
@@ Line 14: / Line 16: @@
 *6x6" wafers or
 *6x4" wafers or
-*24x2" wafers or
+*24x2" wafers
+|
+*4x6" wafers or
+*4x4" wafers or
+*2x2" wafers
 |-
 | Pre-clean
 |RF Ar clean
 |RF Ar clean
+|RF Ar clean
 |-
 | Layer thickness
 |10Å to 1µm
 |10Å to 0.5µm (0.5µm not on all wafers)
+|10Å to 1000Å
 |-
 | Deposition rate
 |2Å/s to 15Å/s
-|1Å to 10 Å/s
+|1Å/s to 10 Å/s
+|About 1Å/s
 |-
 |}