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Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions

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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
|-  
|-  
| Batch size
| Batch size
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*6x6" wafers or
*6x6" wafers or
*6x4" wafers or
*6x4" wafers or
*24x2" wafers or
*24x2" wafers
|
*4x6" wafers or
*4x4" wafers or
*2x2" wafers
|-
|-
| Pre-clean
| Pre-clean
|RF Ar clean
|RF Ar clean
|RF Ar clean  
|RF Ar clean  
|RF Ar clean
|-
|-
| Layer thickness
| Layer thickness
|10Å to 1µm  
|10Å to 1µm  
|10Å to 0.5µm (0.5µm not on all wafers)
|10Å to 0.5µm (0.5µm not on all wafers)
|10Å to 1000Å
|-
|-
| Deposition rate
| Deposition rate
|2Å/s to 15Å/s
|2Å/s to 15Å/s
|1Å to 10 Å/s
|1Å/s to 10 Å/s
|About 1Å/s
|-
|-
|}
|}