Specific Process Knowledge/Thin film deposition/Deposition of Platinum: Difference between revisions

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| Layer thickness
| Layer thickness
|10Å to 1µm
|10Å to 5000Å
|10Å to 1 µm
|10Å to 5000Å
|-
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| Deposition rate
| Deposition rate

Revision as of 09:05, 19 September 2011

Platinum can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Wordentec)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
Pre-clean RF Ar clean RF Ar clean
Layer thickness 10Å to 5000Å 10Å to 5000Å
Deposition rate 2Å/s to 15Å/s 10Å/s to 15Å/s
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