Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions
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== Chromium deposition == | |||
Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment. | Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment. | ||
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! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]]) | |||
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]) | ||
|- | |- | ||
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*6x4" wafers or | *6x4" wafers or | ||
*6x6" wafers | *6x6" wafers | ||
| | |||
*12x2" wafers or | |||
*12x4" wafers or | |||
*4x6" wafers | |||
| | | | ||
*24x2" wafers or | *24x2" wafers or | ||
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|- | |- | ||
| Pre-clean | | Pre-clean | ||
|RF Ar clean | |||
|RF Ar clean | |RF Ar clean | ||
|RF Ar clean | |RF Ar clean | ||
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|10Å to 1µm | |10Å to 1µm | ||
|10Å to 1µm | |10Å to 1µm | ||
|10Å to 1000 Å | |||
|. | |. | ||
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|2Å/s to 15Å/s | |2Å/s to 15Å/s | ||
|10Å/s to 15Å/s | |10Å/s to 15Å/s | ||
|About 1Å/s | |||
|Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]] | |Depending on process parameters, see [[Sputtering of Cr in Wordentec|here.]] | ||
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Revision as of 12:51, 1 March 2013
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Chromium deposition
Chromium can be deposited by e-beam evaporation. It should be noted that Chromium does not melt but evaporates directly from the solid phase. Chromium can be sputter deposited aswell. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | E-beam evaporation (PVD co-sputter/evaporation) | Sputter deposition (Wordentec) | |
|---|---|---|---|---|
| Batch size |
|
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 1µm | 10Å to 1000 Å | . |
| Deposition rate | 2Å/s to 15Å/s | 10Å/s to 15Å/s | About 1Å/s | Depending on process parameters, see here. |
Studies of Cr deposition processes
Uniformity of Cr layers - Uniformity of Cr layers deposited with different methods and settings
Sputtering of Cr in Wordentec - Settings and deposition rates