Specific Process Knowledge/Lithography/Aligners/MAvsMLA: Difference between revisions
Appearance
m →Yield |
|||
| Line 38: | Line 38: | ||
|+'''Wafer maps at optimal processing conditions for different aligners''' | |+'''Wafer maps at optimal processing conditions for different aligners''' | ||
|- border="0" align="center" | |- border="0" align="center" | ||
|[[Map_MLA2_D90_F2.jpg|300px]] | |[[Image:Map_MLA2_D90_F2.jpg|300px]] | ||
|[[Map_MA6-2_vacuum.jpg|300px]] | |[[Image:Map_MA6-2_vacuum.jpg|300px]] | ||
|[[Map_MA6-1_vacuum.jpg|300px]] | |[[Image:Map_MA6-1_vacuum.jpg|300px]] | ||
|- align="center" | |- align="center" | ||
| Aligner: | | Aligner: Maskless 02 (MLA2). || Aligner: MA6-2 || Aligner: MA6-1 | ||
|} | |} | ||