Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]''' | '''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Disco_Saw click here]''' | ||
=Disco Automatic dicing saw, model DAD321 and DAD3241= | |||
DTU nanolab | DTU nanolab have 2 saws available for dicing substrates into separate chips. Both tools offer versatile processing capabilities, high precision and reliability. | ||
The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device. | The dicers at DTU Nanolab is placed in room 157 on the first floor in bldg. 346. Please notice that this room is not under filter. Generally speaking the dicing process is very dirty, and you should expect particle contaminants on your device. | ||
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In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing. | In general it is ''not allowed'' to bring back your samples into the Cleanroom. You need approval from DTU Nanolab staff to do this, follow the instructions [[Specific Process Knowledge/Wafer cleaning/Bring samples into cleanroom|here]] to apply for approval. Your samples have to be thoroughly cleaned before entry, at a minimum a triton ultrasonic clean followed by a piranha clean. You will only be allowed to use a limited number of tools for the processing after dicing. | ||
== Process information == | |||
'''The user manual, user APV, technical information and contact information can be found in LabManager:''' | |||
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*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=168 DAD 321 Saw in LabManager] | |||
*[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=489 DAD 3241 Saw in LabManager] | |||
===Dicing layout=== | ===Dicing layout=== | ||
The dicer is only capable of cutting straight, uninterrupted lines across the entire substrate. Therefore each the position of each individual die must be carefully considered to maximize yield. | |||
Please see the illustrations for a good and a bad design. | Please see the below illustrations for a good and a bad design. | ||
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The simplest design consists of identically sized chips placed at constant pitch across an entire wafer. While it is possible to cut at varying pitches, it requires a more complex program and leaves more room for user errors. | |||
===Overview of the performance Disco DAD 321 and DAD 3241 Dicer=== | ===Overview of the performance Disco DAD 321 and DAD 3241 Dicer=== | ||
{| border="2" cellspacing="0" cellpadding="10" | {| border="2" cellspacing="0" cellpadding="10" | ||
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*Color screen | *Color screen | ||
|- | |- | ||
!style="background:silver; color:black;" align="left" rowspan=" | !style="background:silver; color:black;" align="left" rowspan="3"|Purpose | ||
|style="background:LightGrey; color:black"|Main usage | |style="background:LightGrey; color:black"|Main usage | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Borofloat | |||
*Fused Silica | |||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*Silicon wafers | |||
|- | |- | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black" rowspan="2"|Substrate type | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*'''Pyrex/Borofloat''' | *'''Pyrex/Borofloat''' | ||
*''' | *'''Silicon bonded to Silicon''' | ||
*'''Silicon bonded to Pyrex/Borofloat''' | *'''Silicon bonded to Pyrex/Borofloat''' | ||
* | *Silicon | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*''' | *'''Silicon''' | ||
*Pyrex/Borofloat | *Pyrex/Borofloat | ||
*Silicon bonded to Silicon | *Silicon bonded to Silicon | ||
*Silicon bonded to Pyrex/Borofloat | *Silicon bonded to Pyrex/Borofloat | ||
|- | |||
|style="background:WhiteSmoke; color:black" colspan="2"| | |||
For other materials, contact tool responsible | |||
(See Labmanager) | |||
|- | |- | ||
!style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance | !style="background:silver; color:black" align="left" valign="top" rowspan="5"|Performance | ||
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[[Image:IMG 20230228 113101.jpg|thumb | |||
[[Image:IMG 20230228 113035.jpg|thumb | |||
{| | |||
| [[Image:IMG 20230228 113101.jpg|thumb|left|Wafer mounting table for DAD 321]]|| [[Image:IMG 20230228 113035.jpg|thumb|UV curing/Tape release]]|| [[Image:IMG 20230228 113020.jpg|thumb|Wafer mounter for DAD 3241]] | |||
|} | |||
<br clear="all" /> | <br clear="all" /> | ||