Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300: Difference between revisions
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IBSD: Ion Beam Sputter Deposition | IBSD: Ion Beam Sputter Deposition | ||
This Ionfab300 from Oxford Instruments is | This Ionfab300 from Oxford Instruments is capable of of both ion sputter etching/milling and sputter deposition. | ||
The etching/milling with Argon alone is done by pure physical sputtering of the surface. This causes redeposition on the sidewalls leaving side wall angles at typically between 70-90 degrees (often closest to 70 degrees). | The etching/milling with Argon alone is done by pure physical sputtering of the surface. This causes redeposition on the sidewalls leaving side wall angles at typically between 70-90 degrees (often closest to 70 degrees). | ||