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Specific Process Knowledge/Lithography/UVExposure/aligner MA6-1: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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==Equipment performance and process related parameters==
==Equipment performance and process related parameters==


{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
{| class="wikitable"
 
|-
 
! scope=row style="text-align: left;" | Purpose
!style="background:silver; color:black;" align="center" width="60"|Purpose  
| Alignment and UV exposure
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black" colspan="2"|
Alignment and UV exposure
|-
|-
 
! scope=row style="text-align: left;" | Exposure modes
!style="background:silver; color:black" align="left" valign="center" rowspan="5"|Performance
|  
 
*Vacuum contact
|style="background:LightGrey; color:black"|Exposure mode
*Hard contact
|style="background:WhiteSmoke; color:black" colspan="2"|
*Soft contact
vacuum contact, hard contact, soft contact, proximity, flood exposure
*Proximity
*Flood exposure
|-
|-
| style="background:LightGrey; color:black"|Exposure light/filters
! scope=row style="text-align: left;" | Exposure light/filters
|style="background:WhiteSmoke; color:black" colspan="2"|
|  
*365 nm (i-line)
*365 nm (i-line)
*broadband (i-, g-, h-line), requires tool change
*broadband (i-, g-, h-lines), requires tool change
*(303 nm, requires tool change)
*303 nm, requires tool change
|-
|-
|style="background:LightGrey; color:black"|Minimum structure size
! scope=row style="text-align: left;" | Minimum resolution
|style="background:WhiteSmoke; color:black" colspan="2"|
| ~1.25 µm
down to 1.25µm
|-
|-
|style="background:LightGrey; color:black"|Mask size
! scope=row style="text-align: left;" | Mask size
|style="background:WhiteSmoke; color:black" colspan="2"|
| 5x5 inches
*5x5 inch
|-
|-
|style="background:LightGrey; color:black"|Alignment modes
! scope=row style="text-align: left;" | Alignment modes
|style="background:WhiteSmoke; color:black" colspan="2"|
|  
*Top side (TSA), ±2µm
*Top side (TSA): ±2 µm
*Backside (BSA), ±5µm
*Back side (BSA): ±5 µm
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Substrate size
|style="background:LightGrey; color:black"|Substrate size
|  
|style="background:WhiteSmoke; color:black" colspan="2"|
*Mask exposure and alignment: 100 mm wafers
Mask exposure and alignment:
*Flood exposure: from samples to 150 mm wafers
* 100 mm wafers
Flood exposure:
* samples up to 150 mm wafers
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Allowed materials
|style="background:WhiteSmoke; color:black" colspan="2"|
| All PolyFabLab allowed materials
All PolyFabLab materials
|-
|-
|style="background:LightGrey; color:black"|Batch
! scope=row style="text-align: left;" | Substrate batch
|style="background:WhiteSmoke; color:black" colspan="2"|
| 1
1  
|-
|}
|}
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