Specific Process Knowledge/Lithography/Descum/plasmaAsher04: Difference between revisions
Created page with "=Plasma Asher 4= Product name: PVA Tepla Gigabatch 380M<br> Year of purchase: 2024 Descum of AZ 5214E on 100 mm wafers. The descum process development was done for a single substrate, as well as 3 substrates (for decreased ashing rate and improved ashing uniformity). The substrates were placed vertically in the glass boat. <gallery style="text-align: center;" widths=250 heights=250> PA_boat_1Wafer_v2.png|Single vertical substrate PA_boat_3Wafer_v2.png|3 vertical substr..." |
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==Comparison of ashing rate between substrate sizes== | ==Comparison of ashing rate between substrate sizes== | ||
It is assumed that the low power descum rates, for different substrate sizes, follows the same pattern as the high power ashing rates, which can be seen [[Specific_Process_Knowledge/Lithography/Strip# | It is assumed that the low power descum rates, for different substrate sizes, follows the same pattern as the high power ashing rates, which can be seen [[Specific_Process_Knowledge/Lithography/Strip/plasmaAsher04_processDevelopment#Process_power_for_plasma_asher_4_&_5|here]]. | ||
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