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Specific Process Knowledge/Etch/Etching of Silicon: Difference between revisions

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'''Feedback to this page''': '''[mailto:photolith@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Lithography click here]'''
<!-- Replace "http://labadviser.danchip.dtu.dk/..." with the link to the Labadviser page-->
== Comparing Lithography methodes at Danchip ==
There are a broad varity of lithography methodes at Danchip. The methodes are compared here to make it easier for you to compare and choose the one that suits your needs.
*[[/Deposition of silicon nitride using LPCVD|Process description using methode 1]]
<!-- Link to the process info page in LabAdviser -->
*[[/Deposition of silicon nitride using LPCVD|Process description using methode 2]]
<!-- Link to the process info page in LabAvdiser -->
==Comparison methode 1 and methode 2 for the process==
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"
|-
|-
|-style="background:silver; color:black"
!
![[Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride|Photolithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|DUV Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|E-beam Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Imprint Lithography]]
![[Specific Process Knowledge/Thin film deposition/PECVD|Two photon polymerization Lithography]]
|-
|-
|-style="background:WhiteSmoke; color:black"
!Generel description
|Generel description - methode 1
|Generel description - methode 2
|3
|4
|5
|-
|-
|-style="background:LightGrey; color:black"
!Pattern size range
|
*~1µm and up
|
*~200nm and up
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*~10nm and up
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*~20nm and up
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*3D ?nm
|-
|-
|-style="background:WhiteSmoke; color:black"
!Resist type
|
*UV sensitive:
**AZ
**SU8
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*DUV sensitive
**fff
|
*E-beam sensitive
**ZEP502A (positive)
**HSQ (negative)
**SU8
|
*Imprint polymers:
**??
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*?? sensitive:
**??
|-
|-
|-style="background:LightGrey; color:black"
!Resist thickness range
|
*~0.5µm to 20µm?
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*~50nm to 2µm?
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*~30nm to 0.5 µm
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*~20nm to 10µm?
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*?nm - ?µm
|-
|-
|-style="background:WhiteSmoke; color:black"
!Typical exposure time
|
2s-30s pr. wafer
|
?-? pr. ?
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?-? pr. µm2
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? pr. wafer
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? pr. µm2
|-
|-
|-style="background:LightGrey; color:black"
!Substrate size
|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|
We have cassettes that fit to
*<nowiki>#</nowiki> 4 small samples (20mm, 12mm, 8mm, 4mm)
*<nowiki>#</nowiki> 6 wafers of 50 mm in size
*<nowiki>#</nowiki> 2 wafers of 100 mm in size
*<nowiki>#</nowiki> 1 wafer of 150 mm in size
|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|
*<nowiki>#</nowiki> small samples
*<nowiki>#</nowiki> 50 mm wafers
*<nowiki>#</nowiki> 100 mm wafers
*<nowiki>#</nowiki> 150 mm wafers
|-
|-style="background:WhiteSmoke; color:black"
!'''Allowed materials'''
|
*Allowed material 1
*Allowed material 2
|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|
*Si, SiO2, III-V materials
|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|
*Allowed material 1
*Allowed material 2
*Allowed material 3
|-
|}
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