Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

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===Comparing the two solutions===
===Comparing the two solutions===


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Revision as of 13:13, 11 July 2011

Wet etching of Titanium

Fume hood: positioned in cleanroom 2.
Wet Etch of Titanium can take place in this pp tank or in a beaker in this fume hood

We have two solutions for wet titanium etching:

  1. BHF
  2. Cold RCA1

Do it by making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. BHF etching can also take place in the PP-etch bath in the fume hood in cleanroom 2.


Comparing the two solutions

BHF Cold RCA1
General description Etch of titanium with or without photoresist mask. Etch of titanium (as stripper or with eagle resist).
Chemical solution HF:NHF NHOH:HO:HO - 1:1:5
Process temperature Room temperature Room temperature
Possible masking materials

Photoresist (1.5 µm AZ5214E)

Eagle resist

Etch rate

Not known (it bubbles while etching)

Not known

Batch size

1-5 4" in beaker 1-25 wafers at a time in PP-etch bath

1-5 4" wafer at a time

Etch bath Beaker or PP-etch bath in the fume hood in cleanroom 2. Beaker
Allowed materials

No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. Make a note on the beaker of which materials have been processed.

No restrictions when used in beaker. Make a note on the beaker of which materials have been processed.


Dry etching of titanium

See the ICP Metal Etch page.