Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions
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{| border="1" cellspacing="0" cellpadding="4" align="left" | {| border="1" cellspacing="0" cellpadding="4" align="left" | ||
! | ! | ||
! BHF | ! width="200" | BHF | ||
! Cold RCA1 | ! width="200" | Cold RCA1 | ||
|- | |- | ||
|'''General description''' | |'''General description''' | ||
| | | Etch of titanium with or without photoresist mask. | ||
Etch of titanium with or without photoresist mask. | | Etch of titanium (as stripper or with eagle resist). | ||
| | |||
Etch of titanium (as stripper or with eagle resist). | |||
|- | |- | ||
|'''Chemical solution''' | |'''Chemical solution''' | ||
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== Dry etching of titanium == | == Dry etching of titanium == | ||
See the [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] page. | See the [[Specific Process Knowledge/Etch/ICP Metal Etcher|ICP Metal Etch]] page. | ||
Revision as of 13:13, 11 July 2011
Wet etching of Titanium
Wet Etch of Titanium can take place in this pp tank or in a beaker in this fume hood
We have two solutions for wet titanium etching:
- BHF
- Cold RCA1
Do it by making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. BHF etching can also take place in the PP-etch bath in the fume hood in cleanroom 2.
Comparing the two solutions
| BHF | Cold RCA1 | |
|---|---|---|
| General description | Etch of titanium with or without photoresist mask. | Etch of titanium (as stripper or with eagle resist). |
| Chemical solution | HF:NHFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _4} F | NHFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _3} OH:HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} OFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} :HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O - 1:1:5 |
| Process temperature | Room temperature | Room temperature |
| Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
Eagle resist |
| Etch rate |
Not known (it bubbles while etching) |
Not known |
| Batch size |
1-5 4" in beaker 1-25 wafers at a time in PP-etch bath |
1-5 4" wafer at a time |
| Etch bath | Beaker or PP-etch bath in the fume hood in cleanroom 2. | Beaker |
| Allowed materials |
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. Make a note on the beaker of which materials have been processed. |
No restrictions when used in beaker. Make a note on the beaker of which materials have been processed. |
Dry etching of titanium
See the ICP Metal Etch page.