Specific Process Knowledge/Thermal Process

Choose a process type

• Oxidation - grow a thermal oxide
• Annealing
• Dope with Boron
• Dope with Phosphorus

Choose an equipment to use

• A1 Furnace Boron drive-in - For oxidation of new wafers and for drive in of Boron pre-dep
• A2 Furnace Boron pre-dep - Dope with Boron: For predeposition of Boron on wafers
• A3 Furnace Phosphorus drive-in - For oxidation of new wafers and for drive in of Phosphorus pre-dep
• A4 Furnace Phosphorus pre-dep - Dope with Phosphorus: For predeposition of Phosphorus on wafers
• C1 Furnace Anneal Oxide - For oxidation and annealing, up to 6" wafer
• C2 Furnace Gate Oxide - For growing of Gate Oxide on new wafers
• C3 Furnace Anneal Bond - For annealing and annealing of bonded wafers
• C4 Furnace Aluminium Anneal - For oxidation and annealing of wafers containing Aluminium
• Furnace Noble - For non-clean annealing and oxidation
• Furnace APOX - Furnace for growing very thick oxide
• Jipelec RTP - For Rapid Thermal Anneal of III-V materials and Silicon based material