Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions

[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium (Al)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium|Chromium (Cr)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Copper|Copper (Cu)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Germanium|Germanium (Ge)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Gold|Gold (Au)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum|Molybdenum (Mo)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Nickel|Nickel (Ni)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Niobium|Niobium (Nb)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Palladium|Palladium (Pd)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Platinum|Platinum (Pt)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver (Ag)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Tantalum|Tantalum (Ta)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Tin|Tin (Sn)]]

[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium|Titanium (Ti)]]   

All the above materials can be deposited with the E-beam Evaporator Temescal, although Sn is not recommended - we found sputtering worked better for that.