Specific Process Knowledge/Back-end processing/Wire Bonder/new page name

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HB100 Full Technical Specifications

Bonding Specifications	Bonding Methods	Wedge–Wedge, Ball–Wedge, Ribbon, Bump
	Bond Head Capability	One head for Wedge & Ball bonding (tool change only)
	Wire Diameter (Gold)	12–75 µm (0.5–3 mil)
	Wire Diameter (Aluminium)	17–75 µm (0.7–3 mil)
Wire & Ribbon Handling	Ribbon Size	Max. 25 × 250 µm (1 × 10 mil)
	Wire Spool Size	2" diameter
	Wire Feed Angle / Immersion Depth	90° deep access / 14 mm immersion
Ultrasonic & Bonding Parameters	Ultrasonic Frequency	63.3 kHz PLL control (110 kHz option)
	Ultrasonic Power	0–10 W
	Bond Time	0–5 seconds
	Bond Force	10–200 cN
	Bonding Tool Size	1.58 mm Ø × 19 mm length (0.0624" × 0.750")
	Wire Termination	Bond Head Tear or Clamp Tear
Mechanics & Motion Control	Z-Drive / Resolution	Lead screw motor / 0.5 µm
	Motorized Z Travel	100 mm (3.9")
	X–Y Drive / Resolution	Linear motors / 0.1 µm
	Motorized X–Y Travel	100 mm (3.9")
	Max. Component Width	400 mm (15.7")
	Rotation Drive Accuracy	±0.5°
Control & Interface	Axis Control	Joystick
	Screen Size	21" touchscreen
	Software Environment	Industrial PC with Windows
Camera & Optics	Camera System	Dual camera (detail + overview)
	Magnification	Up to 150×
	View Mode	Simultaneous detail & overview
Heater Stage	Size	90 mm Ø surface (mechanical & vacuum clamping)
	Temperature Range	Up to 200 °C ±1 °C
	Clamping	Mechanical & vacuum

For detailed information on compatible wires and bonding tools for the HB100, visit the TPT Wires & Tools page.

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The TPT HB100 wire bonder is supplied with wires and tools, and can be configured to mount either 25 µm diameter gold wire or 33 µm diameter aluminium wire. To change the wire, please contact the tool’s responsible person. The system features motorized Z, Y, and X axes along with bond head rotation, enabling precise and flexible operation. The integrated TPT software includes a library of recipe templates, allowing users to create and customize process recipes according to the bonding method and wire type.

HB100 Bonding Parameters – 25 µm Gold Wire

First Bond	Ultrasonic Power (US)	150-200
	Bond Time	80-200
	Bond Force	250-450
Second Bond	Ultrasonic Power (US)	150-200
	Bond Time	80-200
	Bond Force	300-400
Wire	Wire Diameter	25 µm (Gold)
	Wire Detect	First Bond: 20 / Second Bond: 0
Loop	Loop Height	500(short length bonds)-5000 (long length bonds)
	Tail Mode (Clamp Feed Length)	350-500
Temperature
	Stage	0-120 (No need of temp when high US(>300))
Bond Positions	First Bond (X1, Y1)	Teach first bond to register coordinates
	Second Bond (X2, Y2)	Teach second bond to register coordinates
Bond directions
	Package (P) & chip (1)	P>P 1>1 P>1 1>P

Automatic process

When creating a new recipe, the bonding plan must be defined at the startup. While setting up a new wire, specify the first and second bond locations, this will automatically register the bonding plan (visible in the Bonding Plan screen).

The number of wires created will correspond to the number of bonds required. After registering the wires, check the bond direction under the Wire and Chips columns. These directions may appear as P>P, 1>P, or 1>2. Adjust them as needed to match your bonding requirements.

To perform multiple bonds in sequence, select Continue Package. This will make multiple bonds and ensure the ball is created after each bond process.

Autoprocess with bonding plans for different bond lengths and directions

• For more details contact thcl@dtu.dk or prakus@dtu.dk