Specific Process Knowledge/Characterization/Particle Scanner Takano: Difference between revisions
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The instrument detects, counts and sizes defects on wafers with semiconductor substrate materials. The instrument uses a 405 nm laser beam which is scanning over the wafer surface to detect defect contamination, i.e. particles. When the laser beam hits a particle, it will scatter and be detected. | The instrument detects, counts and sizes defects on wafers with semiconductor substrate materials. The instrument uses a 405 nm laser beam which is scanning over the wafer surface to detect defect contamination, i.e. particles. When the laser beam hits a particle, it will scatter and be detected. | ||
The scan results are displayed in color-coded wafer maps, histograms and summaries. | The scan results are displayed in color-coded wafer maps, histograms and summaries. | ||
[[File:IMG 9822.JPG|350px|right|thumb|Takano tool at DTU Nanolab. Photo by Patama Pholprasit, DTU Nanolab.]] | |||
===Specifications=== | ===Specifications=== | ||