Specific Process Knowledge/Back-end processing/Wire Bonder/new page name: Difference between revisions
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===Table: | ===Table: HB100 Full Technical Specifications=== | ||
{| border="2" cellpadding=" | {| border="2" cellpadding="4" cellspacing="0" style="border-collapse:collapse; width:100%;" | ||
|+ '''HB100 Full Technical Specifications''' | |+ style="font-weight:bold; font-size:110%;" | '''HB100 Full Technical Specifications''' | ||
|- | |- | ||
! rowspan="6" align="center"| Bonding Specifications | ! rowspan="6" align="center" style="background:#f0f0f0;"| Bonding Specifications | ||
| Bonding Methods | | Bonding Methods | ||
| | | Wedge–Wedge, Ball–Wedge, Ribbon, Bump | ||
|- | |- | ||
| Bond Head Capability | | Bond Head Capability | ||
| Line 34: | Line 34: | ||
| 17–75 µm (0.7–3 mil) | | 17–75 µm (0.7–3 mil) | ||
|- | |- | ||
! rowspan="3" align="center"| Wire & Ribbon Handling | ! rowspan="3" align="center" style="background:#f0f0f0;"| Wire & Ribbon Handling | ||
| Ribbon Size | | Ribbon Size | ||
| Max. 25 × 250 µm (1 × 10 mil) | | Max. 25 × 250 µm (1 × 10 mil) | ||
| Line 44: | Line 44: | ||
| 90° deep access / 14 mm immersion | | 90° deep access / 14 mm immersion | ||
|- | |- | ||
! rowspan="6" align="center"| Ultrasonic & Bonding Parameters | ! rowspan="6" align="center" style="background:#f0f0f0;"| Ultrasonic & Bonding Parameters | ||
| Ultrasonic Frequency | | Ultrasonic Frequency | ||
| 63.3 kHz PLL control (110 kHz option) | | 63.3 kHz PLL control (110 kHz option) | ||
| Line 63: | Line 63: | ||
| Bond Head Tear or Clamp Tear | | Bond Head Tear or Clamp Tear | ||
|- | |- | ||
! rowspan="6" align="center"| Mechanics & Motion Control | ! rowspan="6" align="center" style="background:#f0f0f0;"| Mechanics & Motion Control | ||
| Z-Drive / Resolution | | Z-Drive / Resolution | ||
| Lead screw motor / 0.5 µm | | Lead screw motor / 0.5 µm | ||
| Line 82: | Line 82: | ||
| ±0.5° | | ±0.5° | ||
|- | |- | ||
! rowspan="3" align="center"| Control & Interface | ! rowspan="3" align="center" style="background:#f0f0f0;"| Control & Interface | ||
| Axis Control | | Axis Control | ||
| Joystick | | Joystick | ||
| Line 92: | Line 92: | ||
| Industrial PC with Windows | | Industrial PC with Windows | ||
|- | |- | ||
! rowspan="3" align="center"| Camera & Optics | ! rowspan="3" align="center" style="background:#f0f0f0;"| Camera & Optics | ||
| Camera System | | Camera System | ||
| Dual camera (detail + overview) | | Dual camera (detail + overview) | ||
| Line 102: | Line 102: | ||
| Simultaneous detail & overview | | Simultaneous detail & overview | ||
|- | |- | ||
! rowspan="3" align="center"| Heater Stage | ! rowspan="3" align="center" style="background:#f0f0f0;"| Heater Stage | ||
| Size | | Size | ||
| 90 mm Ø surface (mechanical & vacuum clamping | | 90 mm Ø surface (mechanical & vacuum clamping) | ||
|- | |- | ||
| Temperature Range | | Temperature Range | ||
| Line 111: | Line 111: | ||
| Clamping | | Clamping | ||
| Mechanical & vacuum | | Mechanical & vacuum | ||
|- | |- | ||
|} | |} | ||
''For | ''For detailed information on compatible wires and bonding tools for the HB100, visit the [https://www.tpt-wirebonder.com/wires_tools/ TPT Wires & Tools] page.'' | ||
===Process parameters for Gold wire (25µm)=== | ===Process parameters for Gold wire (25µm)=== | ||