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Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

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NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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Prakus (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
96 edits
No edit summary
Line 37: Line 37:
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
<span style="background:#FF2800">THIS PART IS UNDER CONSTRUCTION</span>
*Al and Au 25µm wire bonding
*Al and Au 25µm wire bonding
*Wedge and ball wire bonding
*Wedge and ball wire bonding
* Au ribbon (100x20µm) bonding<br />(we have tools and wire but it has not been tested)
* Au ribbon (100x20µm) bonding<br />
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Au 25µm wire bonding
*Au 25µm wire bonding
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