Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions
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!border="none" style="background:silver; color:black;" align="center"|Equipment | !border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b>TPT HB100 Wire Bonder</b> | |style="background:WhiteSmoke; color:black"|<b>TPT HB100 Wire Bonder</b> | ||
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder</b> | |style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder K&S 4524</b> | ||
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!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
Revision as of 14:06, 9 August 2025
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TPT HB100 Wire Bonder
Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought i 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):
Ball Wire Bonder K&S 4524
The bonder is currently in building 346 Phoenex lab.
The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.
The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):
| Equipment | TPT HB100 Wire Bonder | Ball Wire Bonder K&S 4524 |
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