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==Ball Wire Bonder K&S 4524==
==Ball Wire Bonder K&S 4524==
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[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
[[Image:K&S_4524_ball_wire-bonder.jpg|300x300px|thumb|The Ball Wire Bonder K&S 4524, <br/> Packlab, Building 347, 1st floor]]
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[[Image:TPTwirebonder_wedge_ball.jpg|300x300px|thumb|Wire bondings: Left: wedge bonding - Right: ball bonding]]
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'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
'''The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):'''  
<!-- remember to remove the type of documents that are not present -->


<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=307 Ball Wire Bonder]
<br clear=all>


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==

Revision as of 14:03, 9 August 2025

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

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TPT HB100 Wire Bonder

Wire bonding is a method of making interconnections between a microchip and other electronics as part of semiconductor device fabrication. The TPT HB100 Wire Bonder was bought i 2025. It is an automatic desktop wire bonder and supports process guidance for the user. The bonder allows wedge- and ball-bonding, ribbon- and bump-bonding with one bond head.

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

TPT HB100 Wire Bonder

Ball Wire Bonder K&S 4524

Is currently in building 346 Pheenex lab.

The Ball Wire Bonder K&S 4524 is for high precision ball bonding. It is a semi-automatic wire bonder with good control of bond placement and bonding parameters.

K&S 4524 ball wire bonder

The user manual(s), user APV(s), technical information and contact information can be found in LabManager (requires login):

Ball Wire Bonder

Equipment performance and process related parameters

Ball wire bond
Equipment TPT HB100 Wire Bonder Ball Wire Bonder
Purpose

THIS PART IS UNDER CONSTRUCTION

  • Al and Au 25µm wire bonding
  • Wedge and ball wire bonding
  • Au ribbon (100x20µm) bonding
    (we have tools and wire but it has not been tested)
  • Au 25µm wire bonding
  • Ball wire bonding
Performance
  • Manual operation
  • Wedge bonding:
    • recommended min. bonding area 200 µm x 200 µm
  • Ball bonding:
    • recommended min. bonding area 200 µm x 200 µm
    • recommended temperature 120 oC.
  • Semi-automatic and manual operation
  • Bond placement laser pointer
  • recommended min. bonding area 100 µm x 100 µm
  • recommended temperature 120 oC.
Substrates
  • Should be able to withstand the wire bonding temperature
  • Typical materials are: Alumina (Al2O3), AluminumNitride (AlN), std. circuit boards (FR4)


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