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Specific Process Knowledge/Back-end processing/Wire Bonder: Difference between revisions

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NLAB-Employees-701, NLAB-LabmanagerAllUsers, Administrators
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==Equipment performance and process related parameters==
==Equipment performance and process related parameters==


[[Image:single wire bonding.jpg|300px|thumb|Ball wire bond]]
[[Image:single wire bonding.jpg|300px|thumb|left|Ball wire bond]]


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>TPT Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>TPT HB100 Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder</b>
|style="background:WhiteSmoke; color:black"|<b>Ball Wire Bonder</b>
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
<span style="background:#FF2800">THIS PART IS UNDER CONSTRUCTION</span>
*Al and Au 25µm wire bonding
*Al and Au 25µm wire bonding
*Wedge and ball wire bonding
*Wedge and ball wire bonding
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|-
|-
!style="background:silver; color:black;" align="center" width="60"|Performance
!style="background:silver; color:black;" align="center" width="60"|Performance
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Manual operation
*Manual operation
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*recommended temperature 120 <sup>o</sup>C.
*recommended temperature 120 <sup>o</sup>C.
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center"|Substrates
|style="background:LightGrey; color:black"|Allowed materials
|colspan="2" style="background:WhiteSmoke; color:black"|
|colspan="2" style="background:WhiteSmoke; color:black"|
*Should be able to withstand the wire bonding temperature
*Should be able to withstand the wire bonding temperature
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