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Specific Process Knowledge/Thin film deposition/Deposition of Tantalum Nitride: Difference between revisions

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*Limited by process time.  
*Limited by process time.  
*Deposition rate (0.2 nm/s) is likely faster than Sputter-System (Lesker)
*Deposition rate (0.16 nm/s) is likely faster than Sputter-System (Lesker)


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