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Specific Process Knowledge/Thin film deposition/Deposition of Tungsten Nitride: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
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*Limited by process time.  
*Limited by process time.  
*Deposition rate (0.6 nm/s) is likely faster than Sputter-System (Lesker)
*Deposition rate (0.2 nm/s) is likely faster than Sputter-System (Lesker)


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