Specific Process Knowledge/Thin film deposition/Deposition of Niobium Nitride: Difference between revisions
No edit summary |
No edit summary |
||
| Line 1: | Line 1: | ||
{{cc-nanolab}} | {{cc-nanolab}} | ||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition of Niobium Nitride&action=submit click here]''' | |||
== Deposition of Niobium Nitride == | == Deposition of Niobium Nitride == | ||
Revision as of 19:22, 25 July 2025
The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.
Feedback to this page: of Niobium Nitride&action=submit click here
Deposition of Niobium Nitride
Deposition of ScN can only be done by reactive sputtering using Nb target.
The primary tool for this application is the Cluster-Based, multi-chamber high-vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.:
- Deposition of Niobium Nitride (NbN) using reactive p-DC sputtering in Sputter-System Metal-Nitride(PC3) Source 2 (3-inch target)
At the moment (July 2025) we have a 3-inch Nb target (0.250" thick) for PC1 and PC3.