Specific Process Knowledge/Thin film deposition/Deposition of Niobium Nitride: Difference between revisions
Created page with "{{cc-nanolab}} '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Niobium_Nitride=submit click here]''' == Deposition of Niobium Nitride == Deposition of ScN can only be done by reactive sputtering using Sc target. The only tool for this application is the Cluster-based multi-chamber high vacuum sputtering..." |
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== Deposition of Niobium Nitride == | == Deposition of Niobium Nitride == | ||
Deposition of ScN can only be done by reactive sputtering using | Deposition of ScN can only be done by reactive sputtering using Nb target. | ||
The | The primary tool for this application is the Cluster-Based, multi-chamber high-vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.: | ||
* [[Specific Process Knowledge/Thin film deposition/Deposition of Niobium Nitride/NbN Reactive Sputtering in Cluster Lesker PC3|Deposition of Niobium Nitride (NbN) using reactive p-DC sputtering]] in Sputter-System Metal-Nitride(PC3) Source 2 (3-inch target) | * [[Specific Process Knowledge/Thin film deposition/Deposition of Niobium Nitride/NbN Reactive Sputtering in Cluster Lesker PC3|Deposition of Niobium Nitride (NbN) using reactive p-DC sputtering]] in Sputter-System Metal-Nitride(PC3) Source 2 (3-inch target) | ||
At the moment (July 2025) we have a 3-inch Nb target (0.250" thick) for PC1 and PC3. | At the moment (July 2025) we have a 3-inch Nb target (0.250" thick) for PC1 and PC3. | ||
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Deposition of Niobium Nitride
Deposition of ScN can only be done by reactive sputtering using Nb target.
The primary tool for this application is the Cluster-Based, multi-chamber high-vacuum sputtering deposition system, commonly referred to as the 'Cluster Lesker.' The operating process is thoroughly documented and described in detail.:
- Deposition of Niobium Nitride (NbN) using reactive p-DC sputtering in Sputter-System Metal-Nitride(PC3) Source 2 (3-inch target)
At the moment (July 2025) we have a 3-inch Nb target (0.250" thick) for PC1 and PC3.