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| The DRIE Pegasus is a state-of-art silicon dry etcher. It offers outstanding performance in terms of etch rate, uniformity etc. This page will provide some clues. | | The DRIE Pegasus is a state-of-art silicon dry etcher. It offers outstanding performance in terms of etch rate, uniformity etc. This page will provide some clues. |
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| == User manuals ==
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| * The Danchip user manual from LabManager is found [http://labmanager.danchip.dtu.dk/machine/machine_item.php?refpage=machlist&id=265 >Here<].
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| * The user manual provided by SPTS can be found here [[Media:SPTS Pegasus user manual.pdf|>HERE<]]
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| === Hardware information ===
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| [[Media:Pegasus_sheet_V8.pdf |Hardware Information - Overview]].
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| [[Media:Pegasus_specification_v2.4.pdf|Hardware Information - Detailed]].
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| [[Media:Pegasus_System_Description_&_Differentiation.pdf|The Advantages the Pegasus has over existing Si etchers]].
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| [[Media:Macs_v2.pdf|Robot Handling System Information ]].
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| === Process applications ===
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| [[Media:Pegasus_AcceptanceTest.pdf|The acceptance test for the DRIE-Pegasus system, April 2010]].
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| [[Media:Aerospace.pdf |MEMS in Aerospace]].
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| [[Media:Bio-medical.pdf|Bio Medical]].
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| [[Media:Energy.pdf|MEMS in Energy]].
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| [[Media:Nanotechnology.pdf|Nanotechnology]].
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| [[Media:Packaging-etch.pdf |Packaging Applications]].
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| [[Media:Appl-sheets-4_markets.pdf|General Applications]].
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