Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
New page: Aluminium can be deposited by e-beam evaporation, by sputter and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment. {|... |
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Revision as of 17:28, 8 November 2007
Aluminium can be deposited by e-beam evaporation, by sputter and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Leybold) | E-beam evaporation (Wordentec) | Sputter deposition (Wordentec) | Thermal evaporation (Wordentec) | |
|---|---|---|---|---|---|
| substrate size |
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| Pre-clean | RF Ar clean | Ar ion bombartment | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10Å to 1µm | 10Å to 1500 Å | 10Å to 1 µm | 10Å to ~0.5µm (very time consuming ) | 10Å to 0.5 µm (this uses all Al in the boat) |
| Deposition rate | 2Å/s to 15Å/s | ||||
| Unifromity | |||||
| Roughness |