Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions
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==Deposition of Silicon using sputter deposition== | ==Deposition of Silicon using sputter deposition== | ||
At Nanolab we can sputter silicon with the Lesker Sputter systems (both the single chamber and dual chamber systems). One of the advantages of sputtering is that you can deposit on almost any material you like. | At Nanolab we can sputter silicon with the Lesker Sputter systems (both the single chamber and dual chamber systems). One of the advantages of sputtering is that you can deposit on almost any material you like. In the cluster system you can heat the substrate up to 600 C. | ||
* [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Lesker|Si sputter deposition in the Sputter-System (Lesker)]] - ''includes information on surface roughness and stress'' | * [[Specific Process Knowledge/Thin film deposition/Deposition of Silicon/Si sputter in Sputter-System Lesker|Si sputter deposition in the Sputter-System (Lesker)]] - ''includes information on surface roughness and stress'' | ||