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Specific Process Knowledge/Thin film deposition/Deposition of Tungsten: Difference between revisions

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= Tungsten deposition =
= Tungsten deposition =


Tungsten (W) can be deposited by e-beam evaporation and sputtering. However, in case of evaporation the precess generates a lot of heat (despite water cooling), and this means the pressure rises as the chamber is baking out. It is therefore not easy to deposit films much thicker than 50-60 nm. Sputtering can be used without any particular issues. In the chart below you can compare the deposition equipment.
Tungsten (W) can be deposited by e-beam evaporation and sputtering. However, in case of evaporation the process generates a lot of heat, so it is not easy to deposit films much thicker than 50-60 nm. Sputtering can be used without any particular issues. In the chart below you can compare the deposition equipment.


==Evaporation of W==
==Evaporation of W==
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