Specific Process Knowledge/Back-end processing: Difference between revisions
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**[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | **[[/Wire Bonder#Ball Wire Bonder K&S 4524|Ball Wire Bonder]] | ||
<br> | <br> | ||
*Wafer | *Wafer Dicing and Machining | ||
**[[/Polisher CMP|Polisher CMP - located in the cleanroom]] | **[[/Polisher CMP|Polisher CMP - located in the cleanroom]] | ||
**[[/Polishing machine|Polisher/Lapper machine]] | **[[/Polishing machine|Polisher/Lapper machine]] | ||
| Line 35: | Line 35: | ||
**[[/FlipScribe|FlipScribe]] | **[[/FlipScribe|FlipScribe]] | ||
**[[/FlexScribe|FlexScribe]] | **[[/FlexScribe|FlexScribe]] | ||
** | **Wafer Scriber | ||
**[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]] | **[[/Disco Saw|Dicing Saw Disco DAD 321 (old saw)]] | ||
**[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]] | **[[/Disco Saw|Dicing Saw Disco DAD 3241 (new saw 2021)]] | ||